ENVIRONMENTALLY SOUND PHOTOREACTIVE CLEANING
UVTech Systems of Wayland, Massachusetts has launched manufacturing of the XLC-100, a UV-photoreactive dry cleaning system for optical disc stampers, semiconductors and thin film heads. Extensive applications work with customer stampers confirms the complete dry removal of photoresist films.
THE
SYSTEM
The XLC-100 is the culmination of 10 years of product development and
field evaluations, resulting in a highly reliable, compact, environmentally
sound, cost competitive system. Intuitive recipe selection and system
controls are handled by a multi-functional user-friendly operating system.
The UVTech XLC-100 is highly cost effective, and will replace ashers
and wet benches for the removal of organic and inorganic contamination.
APPLICATIONS
The main applications for the XLC-100 are for bulk removal of photoresist
and other residues. Extensive applications work and data generation
with customer samples have resulted in several standard, “green”
process recipes. AFM data confirms removal without surface damage, and
XPS analysis shows complete carbon removal.
FEATURES
COMPACT: small footprint - 36"x42", ergonomic access
PRODUCTIVE: throughput of 20 wafers per hour, process dependent
AUTOMATED: recipe-driven, user friendly
ECOLOGICAL: green oxidation/reduction recipes, near-zero emissions – no waste products
RELIABLE: “Bronze Man” cycling & our “Customer Satisfaction Guarantee”
ECONOMICAL: low cost of ownership compared to wet process/cleaning equipment
HIGHER YIELD: reduced handling, fewer defects, lower cost per part, higher yield
SPECIFICATIONS
SUBSTRATE SIZE: 150-200mm
THROUGHPUT: 20 wafers per hour, process dependent
UV SOURCE: solid state laser
HANDLING: 3-axis robot
GASES: recipes based on oxygen & ozone
EMISSIONS: ‘near-zero’ – largely CO2 & H2O
SYSTEM SIZE/WEIGHT: 36”W x 42”L x 74”H / 475 lbs
