COMPANY AND PRODUCT
UVTech Systems, Inc. designs, manufactures, and services equipment used in the fabrication of semiconductor devices from our facility in Wayland, Massachusetts. UVTech’s product is the XLC-100, an innovative system using a ‘green’ oxidizing gas mixture for environmentally sound cleaning. The XLC-100 is automated for production use, the result of four tool generations.

MISSION
UVTech’s mission began in 1994 with an idea to create an environmentally sound cleaning process for the semiconductor industry. The most compelling reason for pursuing ‘green’ industrial cleaning is the increasing incidence of cancer which has been positively linked to chemical toxins in our ecosystem. UVTech has focused its resources on developing an all-dry, ecologically sound organic cleaning process, backed by patented technology. Our mission is to make a positive impact on the earth’s environment by replacing current polluting chemical cleaning processes with a non-polluting gas technology embedded in a compact, reliable piece of equipment.

GREEN AND COST EFFECTIVE
The XLC-100 wafer cleaning system is designed to provide ‘zero emissions’ with no waste-
treatable by-products. It ‘sweeps’ a UV laser beam and stream of gas across surfaces, reacting and removing contaminants from wafer surfaces. X-ray photoemission spectroscopy data shows that there are no detectable carbon residues remaining after cleaning. Atomic-force-microscopy data confirms that the cleaned surface is unaffected by the process. It is a single step, all-dry process. Patents are pending.

The XLC-100 is also cost effective. It will replace existing multi-step cleaning processes requiring several individual cleaning tools and involving acids, solvents, halogens, and large volumes of de-ionized water to clean wafers. Some of these chemicals pollute our atmosphere and ground water daily.

TECHNOLOGY ENABLING
The dry photoreactive species in the XLC-100 process can clean intricate topography and very thin films without causing damage, important for leading edge devices. The XLC-100 is light years ahead of the competition.

VALUES
The XLC-100 is produced by UVTech’s experienced team of professionals. As a company and as individuals, we place a high value on creative freedom, diligent effort, teamwork, business integrity, and environmental mindfulness.

HISTORY
1993
1st demonstration of focused blade of UV light and oxygen to remove organic films. 1st patent application filed in September.

1994
UVTech incorporated, prototype Laser Broom built and tested, and cleaning applications started with major IC companies.

1995
Mark I Laser Broom built and shipped to Praxair for gas R&D and tests with IC companies. 1st patent applications for gas recipes filed.

1996
2nd patent application filed, new optical system complete, and results of wafer cleaning and damage tests published in Future Fab magazine.

1997
1st patent issues and private capital financing for Mark II Laser Broom secured. Business plan for producing automated tools written.

1998
2nd patent issues, and Mark II Laser Broom design complete. UVTech identifies and contacts potential strategic partners for commercialization.

1999
Mark II Laser Broom built and tested along with 5-stick gas mixing system for recipes. Mark III designed to reduce cost and footprint of Broom.

2000
Mark III system reliability testing and applications work continues, with product announcement at SEMICON WEST.

2001
Partnership formed with Novellus Systems, Inc. for joint R&D and licensing of technology. New optical system developed with improved gas nozzles.

2002
R&D and applications development with Novellus continues. The Mark IV Laser Broom was designed for reduced cost and footprint, and was exhibited at Mediatech where it ran continuously for 3 days.

2003
UVTech Systems independently researches lower cost process and system for production use.

2004
Mark V XLC-100 Laser Cleaning System built and tested as the 1st all-dry photoresist removal system. New patent application filed; three patents pending.

2005
Manufacturing of XLC-100 systems initiated for introduction in 2006. Two additional patents filed.

2006
On March 17, a demonstration of the 1st manufactured system given. Following GS3 visits, the XLC-100 passes S2S8 and CDRH guidelines to become an IC FAB compatible system.