ENVIRONMENTALLY SOUND PHOTOREACTIVE CLEANING

APPLICATIONS
The main applications for the XLC-100 are for bulk removal of photoresist and other residues. Extensive applications work and data generation with customer samples have resulted in several standard, “green” process recipes. AFM data confirms removal without surface damage, and XPS analysis shows complete carbon removal.

FEATURES
COMPACT: small footprint, ergonomic access

PRODUCTIVE: throughput of 20 wafers per hour, process dependent

AUTOMATED: recipe-driven, user friendly

ECOLOGICAL: green oxidation/reduction recipes, near-zero emissions – no waste products

RELIABLE: “Bronze Man” cycling & our “Customer Satisfaction Guarantee”

ECONOMICAL: low cost of ownership compared to wet process/cleaning equipment

HIGHER YIELD: reduced handling, fewer defects, lower cost per part, higher yield

SPECIFICATIONS
SUBSTRATE SIZE: 150-200mm
THROUGHPUT: 20 wafers per hour, process dependent
UV SOURCE: solid state laser
HANDLING: 3-axis robot
GASES: recipes based on oxygen & ozone
EMISSIONS: ‘near-zero’ – largely CO2 & H2O
SYSTEM SIZE/WEIGHT: 36”W x 42”L x 74”H / 475 lbs