UVTech's patented cleaning technology uses 'green' gasses coupled with laser light to remove organic materials from the surface of silicon wafers and other substrates.

The light and gas reaction creates a Gas Reaction Zone (GRZ) which photochemically and/or photoablatively removes selected material from the surface. No solvents or chemicals are used during the process and only 'green' inert gasses such as Oxygen and Nitrogen are used. For certain applications requiring an oxidizing reaction, oxygen is converted to ozone via a built in ozone generator.

The reaction does not require any additional heating and any heat generated by the reaction is localized to the reaction site and causes no damage to the underlying surface.

Any by-products generated from the reaction are considered non-toxic and contain no PFC's (PerFlouroChemicals) or HAP's (Hazardous Air Pollutants) and contain only trace amounts of VOC's (Volatile Organic Compounds) and hydrocarbons.

Close-up view of a typical GRZ
(Gas Reaction Zone)

UVTech Systems, Inc.     490 Boston Post Rd    Sudbury, MA 01776
P: (978) 440-7282   F: (978) 440-7099    david.elliott@uvtechsystems.com

Example of Removed Photoresist

Photoresist Remains

Photoresist Removed