Edge Bead Removal Application
UVTech Systems, Inc. 490 Boston Post Rd Sudbury, MA 01776
P: (978) 440-7282 F: (978) 440-7099 david.elliott@uvtechsystems.com
Surface Preparation and Cleaning Conference (SPCC)
SEM image showing the edge bead removed from a semiconductor wafer.
Image of the laser removing the bead from the edge of a semiconductor wafer.
Increased usable die due to a decrease in edge exclusion.
5mm edge exclusion:
80 die lost
0.6mm edge exclusion:
16 die lost
Click for a larger image.
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